The company says future high end chips designed under this approach could reach transistor density equivalent to 14 angstroms, or 1.4nm, by 2031. 1.4nm sounds pretty impressive, but the keyword here is equivalent. Huawei is not saying it has suddenly gained access to the most advanced chipmaking tools in the world, and the company has yet to provide any independent performance data. As of right now, China’s most advanced chipmaking capability is still widely viewed as being around 7nm...
